T10
$10.00
·Non-curing materials
·High thermal conductivityLow thermal resistance
.Thixotropic, low slump
.Low volatile
·Able to achieve very thin bond line thickness
$10.00
·Non-curing materials
·High thermal conductivityLow thermal resistance
.Thixotropic, low slump
.Low volatile
·Able to achieve very thin bond line thickness
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